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| ? ! " # $ % & ' ( ) ( % % ! !! ! *% +, % -% ) ! % # $ ( % $ ' . ( ,&/0 -! *% +, % $1 ' -!) (( + 0) % ( ' % 23'3 + 0 % $ # $ ( *4+4. ' ! "#$%$&&' ()* + + , !" # $ % &' ()*+ ,-+ !) . / "0" 1"2+03"0" 4+"-) &%2) 5/ 2 67&&4+ &8 999 ' micro3 tm www.irf.com 1 downloaded from: http:/// www.irf.com 2 -+ :1"$ !) 999 999 ; ? ? :1"$ !) &% <<+ 999 # 999 & 2< + /& 999 999 / 999 999 # / , ==!"!) 999 / ; ) *$" +"++ 999 999 - / / 999 999 / / 999 999 / / ,-+ *$" (1) 999 999 / / , -+20(1) 999 999 / / > !,=) 999 / > ,-+ =) 999 / > ,?@6!!@a=) 999 / / -*) "# b!3 & 999 / 999 / 2 & 999 / 999 / b<<!3 & 999 999 2 ? *!! & 999 999 2 / ?, -*) / %%++ 999 # 999 b%%++ 999 999 %* / 20 < %++ 999 999 c / 6de-*) ? ; -+(1) 2 -+-+b2+ !"# 2%0)f%!$"= !&"83&7 g+&% ?-<) //a i sd / "" ; / !$"= ;f"3+3+! h -<+&"*2 8" + parameter min. typ. max. units conditions i s continuous source current mosfet symbol (body diode) showing the i sm pulsed source current integral reverse (body diode) p-n junction diode. v sd diode forward voltage CCC CCC -1.2 v t j = 25c, i s = -0.61a, v gs = 0v t rr reverse recovery time CCC 35 53 ns t j = 25c, i f = -0.61a q rr reverse recovery charge CCC 26 39 nc di/dt = -100a/s $ % " s d g 999 999 # 999 999 downloaded from: http:/// www.irf.com 3 0.01 0.1 1 10 0.1 1 10 d ds 20s pulse width t = 25c a -i , drain-to-source current (a) -v , drain-to-source voltage (v) j -1.5v vgs top - 7.5v - 5.0v - 4.0v - 3.5v - 3.0v - 2.5v - 2.0v bottom - 1.5v 0.01 0.1 1 10 0.1 1 10 d ds 20s pulse width t = 150c a -i , drain-to-source current (a) -v , drain-to-source voltage (v) j vgs top - 7.5v - 5.0v - 4.0v - 3.5v - 3.0v - 2.5v - 2.0v bottom - 1.5v -1.5v 0.01 0.1 1 10 1.5 2.0 2.5 3.0 3.5 4.0 4.5 t = 25c t = 150c j j gs d a -i , drain-to-source current (a) -v , gate-to-source voltage (v) v = -10v 20s pulse width ds 0.0 0.5 1.0 1.5 2.0 -60 -40 -20 0 20 40 60 80 100 120 140 160 j t , junction temperature (c) r , drain-to-source on resistance ds(on) (normalized) a i = -0.61a v = -4.5v d gs downloaded from: http:/// www.irf.com 4 !" # $ $ 0 20 40 60 80 100 120 140 160 180 1 10 100 c, capacitance (pf) a ds -v , drain-to-source voltage (v) v = 0v, f = 1mhz c = c + c , c shorted c = c c = c + c gs iss gs gd ds rss gd oss ds gd c iss c oss c rss 0 2 4 6 8 10 0.0 1.0 2.0 3.0 4.0 g gs a -v , gate-to-source voltage (v) q , total gate charge (nc) i = -0.61a v = -16v for test circuit see figure 9 d ds 0.01 0.1 1 10 0.4 0.6 0.8 1.0 1.2 1.4 t = 25c t = 150c j j v = 0v gs sd sd a -i , reverse drain current (a) -v , source-to-drain voltage (v) 0.1 1 10 1 10 100 operation in this area limited by r ds(on) t = 25c t = 150c single pulse a -i , drain current (a) -v , drain-to-source voltage (v) ds d aj 100s 1ms 10ms downloaded from: http:/// www.irf.com 5 + - !" % & '() #* v ds 90%10% v gs t d(on) t r t d(off) t f +& 1 !"# 0.1 % 2 2 i ,$ +& q g q gs q gd v g charge $ -. d.u.t. v ds i d i g -3ma v gs .3 f 50k ? .2 f 12v current regulator same type as d.u.t. current sampling resistors + - 0.1 1 10 100 1000 0.00001 0.0001 0.001 0.01 0.1 1 10 100 notes: 1. duty factor d = t / t 2. peak t = p x z + t 1 2 j dm thja a p t t dm 1 2 t , rectangular pulse duration (sec) thermal response (z ) 1 thja 0.01 0.02 0.05 0.10 0.20 d = 0.50 single pulse (thermal response) downloaded from: http:/// www.irf.com 6 p.w. period di/dt diode recovery dv/dt ripple 5% body diode forward drop re-appliedvoltage reverserecovery current body diode forward current v gs =10v v dd i sd driver gate drive d.u.t. i sd waveform d.u.t. v ds waveform inductor curent d = p. w . period + - + + + - - - 2 ? "0"+!!"832 ? +!!"833*+@@ ? i 0+i" +(3" ? ($-3"++ ? ," ! ? ($(1)"++ <& / 20 !3< =! jji =!0< =!6& / j // - . 01 /// <()+(0!"00+ - . /// 2 3%4 % downloaded from: http:/// www.irf.com 7 micro3 / sot-23 package marking a yw lc part number y = year w = week lot code halogen free indicator part number code reference: a = irlml2402 b =irlml2803 c = irlml2402 d = irlml5103 e = irlml6402 f = irlml6401 g = irlml2502 h = irlml5203 note: a line above the work week (as shown here) indicates lead-free micro3 (sot-23 / to-236ab) part marking informationnote: for the most current drawing please refer to ir website at http://www.irf.com/package !" # $ ! " 0.972 1.900 recommended footprint 0.802 0.950 2.742 !" ! #!$ %&'( % e e1 e d a b 0.15 [0.006] e1 1 2 3 m cba 5 6 6 5 3x l c b a1 3x a a2 abc m 0.20 [0.008] 0.10 [0.004] c c l2 h 4 l1 7 0.89 1.12 symbol max min a1 b 0.01 0.10 c 0.30 0.50 d 0.08 0.20 e 2.80 3.04 e1 2.10 2.64 e 1.20 1.40 a 0.95 bsc l 0.40 0.60 08 millimeters a2 0.88 1.02 e1 1.90 bsc ref 0.54 l1 bsc 0.25 l2 bsc ref inches 8 0 0.0004 min max dimensions notes: 1. dimensioning & tolerancing per ansi y14.5m-1994 2. dimensions are shown in millimeters [inches]. 3. controlling dimension: millimeter. 4. datum plane h is located at the mold parting line. 5. datum a and b to be determined at datum plane h. 6. dimensions d and e1 are measured at datum plane h. dimensions does not include mold protrusions or interlead flash. mold protrusions or interlead flash shall not exceed 0.25 mm [0.010 inch] per side. 7. dimension l is the lead length for soldering to a substrate. 8. outline conforms to jedec outline to-236 ab. downloaded from: http:/// www.irf.com 8 data and specifications subject to change without notice. ir world headquarters: 233 kansas st., el segundo, california 90245, usa tel: (310) 252-7105 tac fax: (310) 252-7903 visit us at www.irf.com for sales contact information . 07/2008 ? % 2.05 ( .080 ) 1.95 ( .077 ) tr feed direction 4.1 ( .161 ) 3.9 ( .154 ) 1.6 ( .062 ) 1.5 ( .060 ) 1.85 ( .072 ) 1.65 ( .065 ) 3.55 ( .139 ) 3.45 ( .136 ) 1.1 ( .043 ) 0.9 ( .036 ) 4.1 ( .161 ) 3.9 ( .154 ) 0.35 ( .013 ) 0.25 ( .010 ) 8.3 ( .326 ) 7.9 ( .312 ) 1.32 ( .051 ) 1.12 ( .045 ) 9.90 ( .390 ) 8.40 ( .331 ) 178.00 ( 7.008 ) max. notes: 1. controlling dimension : millimeter. 2. outline conforms to eia-481 & eia-541. note: for the most current drawing please refer to ir website at http://www.irf.com/package downloaded from: http:/// |
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